Products
for Back-End Process
Panel FOUP Load Port
Support Next Generation Integration Technology (FOPLP) on Large Panel
250 x 250 mm
300 x 300 mm
510 x 515 mm
600 x 600 mm
Tape Frame FOUP Load Port
Yield Improvement in Post-process
380mm Tape Frame
Tape Frame Wafer EFEM
EFEM Solution for 3-D Stacking Device Process (Semiconductor Manufacturing Process using Tape Frame)
380mm Tape Frame
for Front-End Process
300mm FOUP Load Port
(Smart SELOP-8 Series)
Contribution to Further Miniaturization (1xnm)
N2 purge
300mm
300/200mm Auto Switch Load Port
300mm FOUP and 200mm Open Cassette Both Can be Used Just by Remounting!
300mm
200mm
SMIF Load Port
Contribute to High Throughput at 200mm Process Line by Automation
200mm
300mm N2 EFEM
Ability to Perform Cutting Edge Processes by Regulating Ox/H2O Levels Within the EFEM
N2 purge
300mm
300mm EFEM
More Professionally, More Efficiently Support Semiconductor Technology
300mm
300mm Sorter
Supporting Highly Efficient and Stable Wafer Sorting
300mm
Automated Wafer Transportation System for LED/Power Semiconductor
Applicable for Increasing Size of LED/Power Semiconductor Wafer
LED
Power Semiconductor
